Investing.com — Shares in BE Semiconductor Industries (AS:BESI) (Besi) rose on Thursday after the Dutch chipmaking parts supplier said it had received an order for new bonding systems from a “leading” semiconductor manufacturer.
In a statement, Duiven-based group said the order was for 26 of its hybrid bonding systems, a type of chip packaging required for artificial intelligence applications. The company noted that the tools are scheduled for delivery in the fourth quarter of this year and the first quarter of 2025.
In a statement, Chief Executive Richard Blickman said the order “helps confirm the favorable long-term prospects and roadmap anticipated for Besi’s hybrid bonding systems in next generation AI related logic, memory and consumer related computing applications over the next decade.”
Besi added that it expects to see additional hybrid bonding orders from other customers in the current quarter.
Analysts at Morgan Stanley said in a note to clients that while the announcement represents a “significant milestone” for the firm’s hybrid bonding program, the size of the order falls within its previously guided range of 25 to 35 tools.
“As such, we currently see no need to change our estimates,” the analysts said.
