EnSilica, a provider of mixed signal application-specific integrated circuits (ASICs), announced its entry into the Taiwan Semiconductor Manufacturing Company’s (TSMC) Design Center Alliance (DCA) on Thursday.
The AIM-traded firm said the strategic partnership positioned it to leverage TSMC’s advanced semiconductor technologies and expertise, enhancing its ability to deliver next-generation system-on-chip (SoC) solutions for a wide range of applications.
It said the TSMC Design Center Alliance, part of the Open Innovation Platform (OIP), aimed to reduce design barriers for customers by offering comprehensive chip implementation services and system-level design solutions.
By joining the alliance, EnSilica said it would gain access to TSMC’s cutting-edge process technologies and design resources, which would enable the company to develop more sophisticated and efficient SoCs.
That would include mixed signal devices for industrial and automotive sectors, as well as advanced communications and edge artificial intelligence (AI) chips.
“Joining the TSMC DCA programme marks a significant achievement for EnSilica,” said chief executive officer Ian Lankshear.
“Our deep expertise in mixed signal and RF design, combined with TSMC’s advanced technology, positions us to deliver unparalleled solutions to our mutual customers.”
