TSMC expects more powerful computer chips with over a trillion transistors through advanced multi-chiplet designs in the coming years.
Recently, TSMC, the global giant in chip foundries, announced its audacious goal to create chips equipped with a trillion transistors by the year 2030 at the International Electron Devices Meeting (IEDM) conference held in San Francisco, signalling a remarkable advancement in chip complexity.
Concurrently, the company is pushing fabrication boundaries, aiming for 200 billion transistors on a single silicon piece. Committing to 2nm-class N2 and N2P nodes, plus 1.4nm-class A14 and 1nm-class A10 processes by 2030.
TSMC’s strategy involves a dual focus on advanced 3D packaging of multiple chiplets and monolithic chips, leveraging a 3D chipmaking approach to overcome existing limitations. Key milestones include the commencement of 2nm production in 2025, propelling advancements in miniaturisation, and the long-term vision of creating 1nm monolithic chips, each with a staggering 200 billion transistors.
Recent developments, such as Samsung’s introduction of 3nm Gate-All-Around (GAA) transistor technology, add layers of competition and innovation to the landscape. The company looks forward to tech advancements like CoWoS, InFO, and SoIC, aiming to create multi-chiplet solutions with over a trillion transistors by 2030.
The semiconductor industry has witnessed a trend towards multi-chiplet designs in recent years, as seen in AMD’s Instinct MI300X and Intel’s Ponte Vecchio, each comprising dozens of chiplets. TSMC predicts that this trend will intensify, with multi-chiplet solutions featuring over a trillion transistors becoming a reality in the coming years.
TSMC has played a pivotal role in advancing next-gen cloud solutions and AI accelerators, as demonstrated by the utilisation of its technology in AWS Graviton4, Microsoft Azure’s custom chips, and Google’s Tensor Processing Units. Beyond cloud computing and smartphones, rumours of Apple incorporating TSMC’s 3nm chips for advanced AI features in iOS 18 hint at the broader impact of these technological strides.
This interconnected ecosystem, where TSMC’s innovations fuel the demands of industry giants, forms a symbiotic loop of progress with global implications. However, manufacturing hurdles, cost considerations, and geopolitical tensions pose significant uncertainties.
Despite these challenges, TSMC’s initiative can potentially revolutionise fields ranging from artificial intelligence and high-performance computing to autonomous vehicles and medical technology. As the chipmaking sector navigates uncharted territory, it is evident that TSMC’s vision is steering the industry toward greater complexity and miniaturisation.
